By Suryadevara Babu
Advances in Chemical Mechanical Planarization (CMP) provides the most recent details on a mainstream method that's severe for high-volume, high-yield semiconductor production, or even extra in order machine dimensions proceed to lessen. The expertise has grown to surround the elimination and planarization of a number of steel and dielectric fabrics and layers either on the machine and the metallization degrees, utilizing diversified instruments and parameters, requiring advancements within the keep an eye on of topography and defects.
This very important e-book deals a scientific assessment of basics and advances within the quarter. half One covers CMP of dielectric and steel movies, with chapters concentrating on using specific options and techniques, and on CMP of specific numerous fabrics, together with extremely low-k fabrics and high-mobility channel fabrics, and finishing with a bankruptcy reviewing the environmental affects of CMP strategies.
Part addresses consumables and approach regulate for better CMP, and contains chapters at the coaching and characterization of slurry, diamond disc pad conditioning, using FTIR spectroscopy for characterization of floor procedures, and techniques for defection characterization, mitigation, and reduction.
- Considers options and strategies for CMP of dielectric and steel films
- Includes chapters dedicated to CMP for specific materials
- Addresses consumables and strategy keep watch over for superior CMP
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Extra resources for Advances in Chemical Mechanical Planarization (CMP) (Woodhead Publishing Series in Electronic and Optical Materials)
Advances in Chemical Mechanical Planarization (CMP) (Woodhead Publishing Series in Electronic and Optical Materials) by Suryadevara Babu