By Hao Yu,Chuan-Seng Tan,Chuan Seng Tan
3D integration is an rising know-how for the layout of many-core microprocessors and reminiscence integration. This publication, Advances in 3D built-in Circuits and Systems, is written to assist readers comprehend 3D built-in circuits in 3 phases: equipment fundamentals, method point administration, and actual designs.
Contents provided during this e-book contain fabrication innovations for 3D TSV and 2.5D TSI; equipment modeling; actual designs; thermal, strength and I/O administration; and 3D designs of sensors, I/Os, multi-core processors, and memory.
Advanced undergraduates, graduate scholars, researchers and engineers may well locate this article helpful for figuring out the numerous demanding situations confronted within the improvement and development of 3D built-in circuits and systems.
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Extra resources for Advances in 3D Integrated Circuits and Systems (Series on Emerging Technologies in Circuits and Systems)
Advances in 3D Integrated Circuits and Systems (Series on Emerging Technologies in Circuits and Systems) by Hao Yu,Chuan-Seng Tan,Chuan Seng Tan